Dimensity 9400 vs Snapdragon 8 Gen 3
Dimensity 9400
Winner89#3 of 6 mobile SoCs · top 50%
Within a hair of the 8 Elite with a cooler-running GPU.
vs
Dimensity 9400 wins by 14 points
Snapdragon 8 Gen 3
75#5 of 6 mobile SoCs · bottom 34%
Last year’s flagship: still a strong GPU, now the value pick.
Overview
Key Differences
Dimensity 9400
- ≈ estimated24% higher SPEC CPU 2017 floating point, one core: 13.6 vs 11
- 24% higher AnTuTu v10: 2,600,000 vs 2,100,000
- 24% higher Geekbench 6 single-core: 2,800 vs 2,250
- 24% higher Geekbench 6 multi-core: 8,700 vs 7,000
- ≈ estimated23% higher SPEC CPU 2017 integer, one core: 9.7 vs 7.9
Snapdragon 8 Gen 3
No measured advantage.
Review
Dimensity 9400 scores 89 overall to Snapdragon 8 Gen 3's 75: #3 against #5 of 6 mobile SoCs.
Dimensity 9400 leads on CPU by 24% (89 (estimated) vs 72 (estimated)), Gaming by 20% (97 vs 81) and Battery by 12% (82 (estimated) vs 73 (estimated)).
Dimensity 9400 is ahead in 6 of 6 benchmarks, the widest gap in SPEC CPU 2017 floating point, one core by 24% (13.6 (estimated) vs 11 (estimated)).
Dimensity 9400 is rated at 11 W (estimated) against 11 W (estimated).
- CPU≈ estimated89 +24%≈ estimated72App launch, browsing, photo processing.
- Gaming97 +20%81GPU throughput in demanding 3D games.
- Battery≈ estimated82 +12%≈ estimated73CPU work per watt of peak power: longer runtime.
- Overall8975
Benchmarks
- SPEC CPU 2017 integer, one core≈ estimated9.7 +23%≈ estimated7.9
- SPEC CPU 2017 floating point, one core≈ estimated13.6 +24%≈ estimated11
- AnTuTu v102,600,000 +24%2,100,000
- Geekbench 6 single-core2,800 +24%2,250
- Geekbench 6 multi-core8,700 +24%7,000
- 3DMark Wild Life Extreme6,000 +20%5,000
Specs
| Spec | Dimensity 9400 | Snapdragon 8 Gen 3 |
|---|---|---|
| CPU | ||
| Cores | 8 (1× X925 + 3× X4 + 4× A720) | 8 (1× X4 + 5× A720 + 2× A520) |
| Architecture | Arm v9.2 | Arm v9.2 |
| Max clock | 3.62 GHz | 3.3 GHz |
| L3 cache | 12 MB | 12 MB |
| GPU | ||
| GPU | Immortalis-G925 MC12 | Adreno 750 |
| Ray tracing | Hardware | Hardware |
| NPU | NPU 890 | Hexagon |
| Memory | ||
| Type | LPDDR5X | LPDDR5X |
| Max speed | 10667 MT/s | 9600 MT/s |
| Max capacity | 24 GB | 24 GB |
| Connectivity | ||
| 5G | Sub-6, 7 Gb/s | Sub-6 + mmWave |
| Wi-Fi | 7 | 7 |
| Bluetooth | 6.0 | 5.4 |
| Modem | — | Snapdragon X75 |
| Power | ||
| Peak package power | 11 W (est.) | 11 W (est.) |
| Node | TSMC N3E | TSMC N4P |
| Misc | ||
| Launched | October 2024 | October 2023 |
| ISP | Imagiq 1090 | Spectra |
| Storage | UFS 4.0 | UFS 4.0 |